Mobile Hardware Sectiones Guide

स्मार्ट फ़ोन रिपेयरिंग क्या होती है.

Display Sectiones.

The Display Section Is Directiy Connected With The CPU To Receive Following Signals.Lcd Data Signal, Reset Signal, Rd signal, Flm signal etc.These Signal Are Given To The LCD module Through The Cpu 2.8v Power Supply Or 1.8v Power Supply Is Given To The Lcd For Functioning.Lcd Signal Interface Filter Are Connected In Many Mobile Cell Phones For Interfacing These Signals of Lcd Module.

Mobile Keypad Section.

The Keyboard Section Of Any Mobile Cell Phone Is Directly Connected With The CPU.This Means That Rows And Columus Of  Keys Are Directly Connected With The CPU.Protector Ic Or Interface Ic or Verector Diode Is Connected In The Row Or Columm Line For The Protection Of  Key Section.

Sim Card Section.

The Sim Card Interface Section Is Directly Connected With The CPU In Most Mobile Cell Phone .If There Is No Power Supply In A Mobile Phone Then The SIM Section Is Connected With The CPU Through The Power Ic .Mainly (VSIM SuppyV2.8), (SIM -RST Supply V2.80), ( SIM CLK +SIM DATA V2.5 ), And SIM GND Are Made In The Sim Section.Control Section VSIM Volt Are Give To The SIM Data Pin From VSIM Pin Through The 10-20 Kilo-Ohms Resistance.

Memory Card Section.

Phones Which Is Connected With Micro Card Section Through A 8 Pin Socket.Memory Card Section Is Made Inside The CPU Description Of These 8 Pin.


  • MMC- DATA-2
  • MMC- DTA0
  • MMC -DATA-1

2.8 Volt Power Is Supplied To Pin Number 4 Form Power Supply For Functioning Of The Memory Card And Connection The 50 To100 Kilo Ohms Resistance In This Power Supply. This Power Supply Is Given To Pin Numbers -1-2-3-7-8 Of Memory Card Socket.One Memory Card Detector Switch Or Pin is Made In Memory Card Socket At Which.If There Is No Memory Card then 1.8V Power Is Continuously Received And After The Memory Is Connected It Becomes Zero.

Speaker Ringer Section.

Ringer Buzzer Or Speaker In Most Mobile Phone Are Connected With The Audio Amplifier IC To Obtain Loud Sound.The Amplifier IC The Sound Or Audio Signal Received From The CPU Of Audio Section.

Mic Interface Section. 

Mic Interface Section Is Directly Connected With The CPU Inmost Mobile Phone Working Voltage MIC 1.8 TO 2.8V Is Supply From The CPU Or The Power Supply Section For Functoning Of The MIC And Positive And Negative Voltage Are Input through Two Capacitors.

  Vibrator Motor Section.

Positive Power Directly Form The Positive End Of The Battery Negative Power Supply Is Given Through A NPN Transistor Or From The Ground Of Any Circuit.

   Ear Speaker Section.

Mobile Phone In Which There Is a Separate Ear Speaker It Is Directly To The CPU.It Receives Sound Via Signals Directlt From The CPU Of FromThe Audio Section inbuilt within The CPU.In Some Mobile Phone These Sound Signals Are Received Via Coil Resistance.Some Mobile Phone Have Audio Ic In The Audio Section Some Mobile Phone Have Audio Amplifier.

 Key BackLight Section.

Led Lights Are Connected According To The Parallel Circuit In The Key Backlight Section.Anode Ends Of  All The LED Are Connected To Each Other And All The Cathode Ends Are To Each Other 2.8 To 3.3V Is Supply For The Functioning Of These Key LED Lights This Power Supply Is Given To The Cathode Ends Of LED From The Ground Ends.Power Supply To The Anode Ends Of LED Lights Is Controlled Using LED Driver Or PNR IC.

 LCD Backlight Section.

LCD Backlight In Mobile Phone Is Made According To The Series Circuit A Boost Voltage Generator Section Is Built For The Supply Of High Voltage 15 To 25 V For The Functioning Of The LCD LED Bosst Coil Boost Volt Driver Ic Rectifier Diode Etc Section.

 Battery Charging Section. 

Charge And System Interface Connector Is Made Togrther In Most Modern Mobile phone Regulator section Is Made separately For The Battery Charging Section In Some Mobile Phone The Battery Charging Section Is Made Inside The Power IC.

Handsfree Earphone Section.

Mainly Hands Free Jack Hands Free Mic Speaker Signal Component And Hands Free Audio Amplifier Are Present In This Section Hands Free Symbol Is Displayed after Connection The Handsfree Jack.

 Power On Off.

Power IC CUP (UCP) Flash Ic RF-CLK, Crystal RF-IF-Power Key Etc.Components Are Present This Section Battery positive Supply Is Given To The Power Ic And Connecting The Battery 2.7 To 3.7 Power ON Volts Are Received At One Tip Of The Power Key Supply Is Given To The CPU Flash IC RF-CLK, Generator SAection RF Crystal RF IC By Which The Mobile Phone Gets Switched On.

Bluetooth Section.

Bluetooth Antenna Bluetooth RF Signal And Signal Components are Made In This Section The Bluetooth Section RF-CLK Signal Is Given To The Bluetooth Driver Ic During Signal Processing.

  Network Section.

Antenna External Antenna Socket RX BAND Pass Filter RF,Crystal FEM, PFO,TX Band Pass, Filter RF IC, CPU Are Connected In The Network Section Signal Received At The Antenna During The RX Is Given To THe Antenna Switch Or FEM Through The Antenna Socket Where The Next Processing Is Completed By Selecting A Frequency Of Proper Band And Is Passed On To The RF IC Through RX Band Pass Filter .RF Signal Out From The RF IC During Tx Is Given To The FEM Or PFO To Amplify The Signal.AfterThe Band Selection Process The signal Is Passed Through The Antenna.

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